Assembly and Rework of Lead Free Package on Package Technology

What are the essential engineering development activities when assembling and reworking PoP components?
In this whitepaper we reveal:

  • The benefits of lead free package on package technology
  • How designers can fit more function into a smaller, lighter space
  • Miniaturization as a driving force in advanced integrated circuit packaging
  • The 7 essential elements of successful PoP package rework

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